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At the westernmost end of Zhuhai, the waves of the Tiger Leaping Gate waterway are flowing into the sea, sharing the tide with the world.

Ltd. announces that its third factory "Yuexin Project", which is laid out in Zhuhai, has officially started the installation and entered the equipment commissioning stage.

This once again refreshed the speed of Zhuhai's industrial development.

Behind the speed of "Yuexin", there is a sense of urgency for enterprises, cities and the chip industry to break through against the trend, and it is this sense of urgency that pushes innovation forward.

Breaking the speed of Zhuhai's industrial development many times

The Yuexin project carries the expectation of whether a city or even an industrial chain can "leap" up in one go.

In the B1 plant of Yuexin project, 16 sets of six-axis circuit board CNC drilling machines are in operation, the machines are roaring, workers are skillfully operating these advanced production equipment from Germany, and the production workshop is a busy scene. This also means that this important industrial project has entered the equipment commissioning stage.

Speed and efficiency is one of the major labels that the outside world has projected on the "Yuexin Project".

Previously, this project had created 16 days to achieve the "land to start construction", 50 days to achieve the first plant topping, 90 days to achieve the second plant topping industrial construction speed, in the history of industrial development in Zhuhai set a benchmark.

The power of benchmark has never been highly anticipated.

In fact, the "Yuexin Project" is the third factory laid out in Zhuhai following the expansion of Nantong Yuexin Semiconductor Project.

"After the Yuexin project is put into operation, Yueya Semiconductor will become a semiconductor packaging and loading board solution provider serving global customers with multiple processes, multiple product lines and multiple factories. At present, the main building of the first phase of the project has been topped out, and according to the plan, it will be fully completed and in production by the end of 2024, with an expected annual output value of 3.5 billion yuan." Xie Fengxia said.

At that time, the project will be built into an intelligent factory for mass production of high-end packaging boards, including R&D design, intelligent production and energy-efficient elements, further promoting the intelligent transformation of the domestic IC packaging board industry.

Layout of key technology import 3 years ago

"The choice to increase production against the trend at this node of time is precisely to grasp the opportunity of industrial transfer of the historic rise of the domestic semiconductor supply chain." said Xie Fengxia, deputy general manager of Zhuhai Yueya Semiconductor Co.

A complete chip, from the bare chip (wafer) and packaging body (packaging board and sealing materials, leads, etc.) combination. The packaging board is the core material for chip packaging, and the technical process of the product is extremely demanding.

"From the perspective of the global market pattern of packaging board, the current degree of localization is low and the self-sufficiency rate is insufficient." Xie Fengxia said.

Relying on the will and ability to play against the wind and walk uphill, a large number of science and technology innovation workers have risen to the challenge and turned the crisis into a breakthrough opportunity.

"Zhuhai Yueya started to layout the technology introduction and key equipment investment of FCBGA carrier board as early as 3 years ago, and was one of the first companies in China to complete the introduction of FCBGA carrier board and successfully put it into mass production, helping to achieve the zero breakthrough of domestic FCBGA carrier board." said Xie Fengxia, deputy general manager of Zhuhai Yueya Semiconductor Co.

Ltd. has grown into a domestic advanced IC package board supplier, and is the leading manufacturer of IC package boards, semiconductor devices and semiconductor modules in China. It is one of the leading R&D and manufacturing companies of IC packaging boards, semiconductor devices and semiconductor modules in China.

"In the past two years, the global packaging substrate production capacity is relatively tight, from the supply chain feedback information FCBGA package loading board will continue to be tight until 2023 or even 2025, relative to the global semiconductor industry, especially the package loading board boom is high, the fastest growth rate." Xie Fengxia firmly believes that Zhuhai Yuexin project will seize the industrial opportunities of Internet of Everything and future digital chips, and help upgrade China's semiconductor industry.

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