Recently, 2019 Nantong New Generation Information Technology Industry Exhibition was successfully held in Nantong International Convention and Exhibition Center. Zhuhai Yueya Semiconductor Co., LTD. (hereinafter referred to as "Zhuhai Yueya"), a subsidiary of Founder IT of Peking University Founder Group, was invited to participate in this exhibition as a key enterprise located in Nantong. It SHOWS THE APPLICATION OF radio frequency chip, high computing power chip, power management chip packaging substrate and embedded packaging substrate and other high technology, and was visited and guided by Nantong Mayor Xu Huimin.

The conference sponsored by the communist party of China (nantong municipal party committee and people's government of nantong, divided into nantong carrier and platform of a new generation of information technology development area, nantong area of main item enterprises, the information technology application innovation exhibition galleries (encore), semiconductor, 5 g and the area of artificial intelligence, big data, Internet and Internet industry exhibition and show demonstration area and so on seven big plate, More than 70 well-known domestic enterprises in the field of new generation information technology participated in the exhibition.

Zhuhai Yueya is the first enterprise in the world to realize the mass production of "core-free" packaging substrate by using "copper column layer adding method". The main products are the packaging substrate and chip embedded packaging substrate for 3G/4G/5G radio frequency power amplifier and its front-end modules, baseband chips and microprocessor chips.

Currently, the capacity expansion of VietAsia Zhuhai plant has been completed, and a new plant in Nantong will be put into production in 2020. The overall plan is to be five times that of Zhuhai plant.

In the future, Zhuhai VietAsia will comply with the development strategic plan of the rise of national semiconductor, further expand the production capacity, enhance the comprehensive competitiveness in the field of intelligent manufacturing, achieve rapid and high-quality development, and commit to become the world's leading packaging substrate semiconductor module and device solution provider.

Source URL：http://3g.k.sohu.com/t/n404651087