The 19th China Semiconductor Packaging and Testing Technology and Market Annual Conference was successfully concluded yesterday afternoon after completing all the agendas. The one-day conference arranged four special exchanges around the theme of the conference: The innovation and opportunity of semiconductor manufacturing equipment, the innovation and cooperation of advanced packaging materials in the post-Moore era, the innovation and trend of advanced sealing and testing and the manufacturing and testing technology of vehicle chip finished products, a total of 40 guests from the industry brought full of dry goods and sincerity to share. In these sharing, "domestic substitution" became the key word of all exchanges. The news agency has specially selected some topics about "domestic substitution" to share as follows.

Topic 1: Innovation and opportunity of manufacturing equipment for semiconductor rear end products

Wang Chi, founder, chairman and technical director of Suzhou Acris Intelligent Equipment Co., LTD., introduced the training ideas and methods of semiconductor enterprise engineers in his book "Training Young Engineers for Semiconductor Industry". In 2021, he intervened in the graduation design of the graduates of Nanjing University of Aeronautics and Astronautics, through the "industry-university-research" way to train young engineers' ideas and specific practices.

Zhang Jianxin, Chairman and deputy general manager of Photonics Technology Co., LTD., gave a special presentation on the application of step cutting technology in Wettable Flank QFN.

Topic Two: Innovation and cooperation of advanced packaging materials in the post-Moore era

Chen Xianming, CEO of Zhuhai Yueya Semiconductor Co., LTD., shared the "supply of high-end IC sealing plate and the urgency of domestic replacement". He believes that in the past ten years, China has made great progress in IC design, packaging and testing of semiconductors, and has the confidence and ability to catch up with world-class enterprises. He more optimistic forecast, domestic counterparts in the next three to five years, will catch up with the international packaging technology today, to achieve the mainstream IC high-end board autonomy. He expects, through the efforts of the industry, to achieve a comprehensive replacement of domestic IC high-end board.

Wuxi Dike Electronic Materials Co., LTD. Semiconductor electronics Division senior marketing manager Zhang Ben to "Dike DKEM help semiconductor electronic adhesive localization" as the topic, from the business of the enterprise, introduced the semiconductor adhesive localization of the R&D and development route.

Huang Chengliang, Business Development Manager of Carl Zeiss (Shanghai) Management Co., LTD., introduced the trends and challenges in the field of advanced packaging and time-based analysis from an industrial practice perspective with the title "Advanced Packaging Analysis in the Post-Moore's Law Era". He believes that in general, the development and trend of advanced packaging is moving towards higher density, smaller interconnected structures, and higher 2.5D and 3D stack architectures, and higher integration.

(Photo: screenshot from mobile phone)

Liu Fengman, a researcher from the Institute of Microelectronics of Chinese Academy of Sciences, shared online "Advances in Microelectronics Packaging technology and challenges in electric Heating Design", which comprehensively introduced the new heat dissipation technologies in the field of semiconductor packaging by leading enterprises and universities in the semiconductor industry.

(Photo: screenshot from mobile phone)

Topic 4: Vehicle chip manufacturing and testing technology

Shi Lei, deputy general manager of Wuxi Huapu Microelectronics Co., LTD., shared the demand analysis and thinking of vehicle system for domestic car standard chip and intelligent manufacturing. He said that in the field of car gauge chip replacement, the most important problem is that the technical quality of recognition is not high, and there are technical barriers. On the whole, the domestic automotive semiconductor industry has a relatively weak foundation and relies heavily on high-end chips and specific chips. He believes that domestic suppliers to seize the market, one is to break the technical barriers of the car gauge chip, the other is to learn and master the whole process of production requirements of the car gauge chip.

(Picture: Real time screenshot from mobile phone)

Due to the "epidemic", the conference was held in a combination of online and offline mode instead of offline. The total number of people watching the two-day conference was nearly 40,000, which also shows the popularity of the semiconductor industry in China.

Source URL：https://cj.sina.com.cn/articles/view/7724709139/1cc6db51300100xshu