VietAsia Semiconductor signed a contract for the expansion of "High-end RF and FCBGA package board p

Date: 2021-07-26　Click: 2112

In response to the rapid development of the semiconductor market and the industrial transfer opportunity of the historic rise of the domestic semiconductor supply chain, with the strong support of the relevant leaders of Zhuhai, Doumen District and Fushan Industrial Park, on the afternoon of July 26, 2021, Zhuhai is the semiconductor co., LTD. (" the more the semiconductor ") and zhuhai toyama industrial park management committee signed the success and the three semiconductor factory expansion high-end rf and FCBGA loading board manufacturing project, the project is the more original factory load and the semiconductor zhuhai nantong more after the semiconductor expansion, again the important planning investment in zhuhai.

About VietAsia Semiconductor No.1 Plant

With the unique Via post copper method and Coreless load plate process, Vietasia Semiconductor's original Zhuhai plant established long-term strategic cooperation with foreign and domestic radio frequency design companies. Moreover, it has become the main supplier of the global radio frequency 4G/5G radio frequency chip onboard board and the strategic supplier of the domestic radio frequency 4G/5G radio frequency chip onboard board, which accounts for more than 80% of the market share. It is also the main supplier of the packaging board for ASIC high computing power chip. With the continuous innovation of Vietasia Semiconductor, Zhuhai factory has incubated and mass-produced embedded sealing loading plate, which has become the first competitive advantage in the industry in terms of technology and output size with its strengths of miniaturized advanced packaging, high performance and high reliability. Created Panel Level fan out and Embedded Die embedded packaging advanced packaging field of revolutionary progress, but also successfully incubated and mass produced digital chip FCBGA sealing loading board, broke the previous history of monopoly by Japan, Korea and Taiwan suppliers, become the first domestic manufacturer of FCBGA sealing loading board mass production.

About VietAsia Semiconductor No.2 Plant

In order to meet the customer's urgent strategic need of domestic supply chain substitution, Nantong Yueya Semiconductor Project was established in 2018, covering a total area of about 150 mu. The project was expanded by investment in August 2018, and mass production of Embedded Die Substrate in the second half of 2020. And in the second half of 2021, the first domestic FCBGA carrier plate to achieve mass production. Based on customer demand growth, we will continue to expand the production of embedded sealed loading plates and double the capacity of FCBGA loading plates after 2022.

About VietAsia Semiconductor Factory No. 3

In order to continue to meet the rapid development and incremental demands of domestic and foreign radio frequency design companies in the era of 5G communication, as well as the future digital chip investment and expansion in all kinds of processors CPU/GPU/NPU/xPU, big data, artificial intelligence, Internet of vehicles, AIoT and other fields of rapid development demand. The project covers an area of about 260 mu. It is planned to complete mass production and put into production in July 2022. It is mainly used for SiP sealing and loading boards for high-end radio frequency chips and medium and high-end FCBGA sealing and loading boards for digital chips. The more the semiconductor factories and three factory will optimize the original zhuhai nantong plant construction experience, breakthrough of nantong factory before creating industry factory three progress record of 100 days, namely, the first 100 days to complete plant construction, the second 100 days to complete the workshop decorate and mechanical and electrical installation equipment, such as entry conditions, the third 100 days with investment in equipment installation, debugging and internal acceptance, Ensure the doubling of Via Post capacity for 4G/5G radio frequency chips and FCBGA for mid and high-end digital chips by July 2022 to quickly meet the urgent technical and capacity needs of domestic and foreign customers in 2022.

After the project, three factories will conduct specialized production and manufacturing respectively. In total, they can provide more than 120,000 Panels per month for Via Post copper column loading plate, 20,000 Panels per month for embedded sealing loading plate, and 60,000 Panels per month for FCBGA sealing loading plate, which will strengthen the weaknesses and weaknesses of Chinese semiconductor in loading plate packaging materials. Continuously maintain the advantages of VietAsia Semiconductor in the world's first radio frequency sealing loading board market, the first embedded sealing loading board industry, the first FCBGA sealing loading board in the country, to contribute to the strong rise of China's semiconductor.

Leaders of the Management Committee of Fushan Industrial Park attended the signing ceremony: Mr. Zhu Jiang, Deputy Secretary of Doumen District Committee and Executive Deputy Director of Fushan Industrial Park Management Committee, Mr. Qu Xianghua, Mr. Lei Hua, Deputy Director of Fushan Industrial Park Management Committee, As well as the Economic Development Bureau of the Management Committee of Fushan Industrial Park, the Construction Bureau, the Finance Bureau, the Fushan Branch of the municipal Natural Resources Bureau, the Fushan Branch of the Municipal Ecological Environment Bureau, the Investment Promotion Center of the Fushan Industrial Park Management, the land reserve Center, the legal Affairs Office and other departments; The LEADERS OF YueYA SEMICONDUCTOR CO., LTD. Were Mr. Chen XIANMING, CEO OF YueYA SEMICONDUCTOR CO., LTD., Mr. Chen ChunLING, Chief Financial OFFICER AND Secretary TO THE BOARD OF DIRECTORS, Mr. Luo Ming, VICE PRESIDENT OF QUALITY, Ms. Xie Fengxia, DIRECTOR of General Management Department, Mr. Zeng Qiongsheng, Director of Manufacturing Department, and Mr. Zhang Wei, DIRECTOR of Marketing Department.

The project of Yueya No.3 Factory can be settled in Fushan Industrial Park quickly, which has won the care and support from the multi-level leaders of Zhuhai, Doumen District and Fushan Industrial Park. Before the signing ceremony, the personnel from both sides communicated and exchanged on their respective issues. On the project investment agreement, land signboard hanging rules after landing, project promotion time node time and preferential policy implementation and other matters of the exchange of views, and reached a consensus. After the talks, the two sides held a signing ceremony for the cooperation project.